1–10 units
- Functional validation
- Quick iterations
- Testing before larger commitment
- Delivery: days
Functional enclosures for electronics — from prototype to production series — without tooling costs, with engineering that understands what goes inside the box.

Additive manufacturing (3D printing) makes sense for electronic enclosures when:
Above 5000 units, we evaluate whether additive manufacturing is still the best option or if transitioning to tooling makes sense.
We design enclosures with real IP protection — not just "splash-resistant". Gasket integration, tested closures, documentation of achieved protection level.
We are honest about the limitations:
When additive manufacturing is not the best option, we help evaluate alternatives.
Ioseph Engenium designs enclosures with deep understanding of what goes inside:
This is especially useful for clients who are also doing automation or gateway projects with us — a single point of contact for enclosure + electronics + firmware.
Want to understand at which volume each process makes sense? Use our conceptual simulator to compare costs between additive manufacturing and injection molding.
Send a brief description of the project — board dimensions, intended quantity, special requirements — and we'll do an initial feasibility analysis.